Research on the Hydrodynamic Electro-chemical Mechanical Polishing for Silicon Wafer with Suspension Fluid
Silicon wafer is one of the key materials of LSI and SLSI and has been widely used in the electronic industries and IT products. In the new century of nano times, silicon wafer needs higher geometry accuracy, lower surface roughness and higher precision machining effecency, but no disfigurement in its surface layer. Nowadays, non-contact polishing still seems to be most efficient method to achieve nano-scale geometry accuracy and maintain surface roughness in the nanometer level even for silicon wafer, but it is still not easier to control its machining course and to obtain well-pleasing machining effecency. In this paper, a hydrodynamic electro-chemical polishing system based on CNC is established with micro-displacement compensating for nano-scale polishing. A new type of compliant polishing tool system is developed, which can turn orthogonal force control subspace and position control subspace to isomorphic position servo space. Moreover, it convert force control deflection to position servo deflection and in this way the polishing force is controlled by micro-displacement compensating with piezoelectricity. Polishing experiments on silicon wafer, in hydrodynamic polishing fluid mixed with nano-scale SiO<,2> abrasive particles, have been conducted to investigate the fundamental machining mechanism.
Hydrodynamical suspension fluid Micro-displacement compensating Electro-chemical polishing Silicon wafer
Jianming Zhan Di Zheng
Faculty of Engineering, Ningbo University, Ningbo, China, 315211
国际会议
第14届全国磨粒技术学术会议(14th Conference of Abrasive Technology in China)
南京
英文
290-294
2007-10-26（万方平台首次上网日期，不代表论文的发表时间）