The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer

摘要：

This study compares the effectiveness of different polishing slurries for Double Sided Polishing process of Silicon wafer in the polished surface roughness and stock removal rate, discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries, also the influence of the pH value, temperature and concentration of the slurries are discussed in this paper. Furthermore, by the optimization of the process parameters, the ultra- smooth of polished surface of silicon wafer has been got with higher efficient.

关键词： Silicon wafer Double sided polishing (DSP) Slurry Optimization

作者: Wei Li Gangxiang HU Xiaodong Hu Xiaozhen Hu

作者单位: PERC Zhejiang University of technology, Hangzhou, China, 310014 Ningbo Institute of Measurement and Testing, Ningbo, China, 315000 Zhejiang Ocean University, Zhoushan, China, 316000

会议类型: 国际会议

会议名称: 第14届全国磨粒技术学术会议(14th Conference of Abrasive Technology in China)

会议地点: 南京

会议语种:英文

页码: 324-328

在线出版日期: 2007-10-26（万方平台首次上网日期，不代表论文的发表时间）