Experimental Study on the Ultraprecision Lapping Technology of the Copper Substrates for Alloy Films
To obtain the amorphous alloy films with superior properties by method of electrochemical deposition, the accuracy requirement for the copper substrates for Alloy Films is extraordinarily strict. The ultraprecision lapping technology for the copper substrate employing polyurethane polishing pad and flannel pad is studied in this paper, surface roughness, material removal rate and change process of surface construction of copper substrates are discussed. The influences of the different lapping parameters on the surface roughness, material removal rate and the influences of lapping load on copper substrate surface formation in the ultraprecision lapping process of copper substrate are both discussed. Experiment results show that the surface scratch will disappear by employing polyurethane polishing pad and flannel pad, and an extremely smooth surface of copper substrate with roughness 6nm Ra is obtained in the final finishing lapping process.
Copper Substrate Ultraprecision Lapping Surface Formation
Congrong Zhu Qin Xu Julong Yuan Donghui Wen Binghai Lv
College of Mechanical Engineering, Zhejiang Ocean University, Zhoushan, China, 316004 Precision Engi Precision Engineering Laboratory, Zhejiang University of Technology, Hangzhou, China, 310014
国际会议
第14届全国磨粒技术学术会议(14th Conference of Abrasive Technology in China)
南京
英文
349-354
2007-10-26（万方平台首次上网日期，不代表论文的发表时间）