A LOW-ORDER THERMAL BRIDGE DYNAMIC MODEL FOR BUILDING SIMULATION

摘要：

The heat transfer characteristics in building window frame have significant three-dimensional characteristics, but window U-value model are often used in most building codes for thermal analyses to simplify the calculations. State model reduction techniques were used to develop low-order three-dimensional heat transfer model for window frame, which is efficient and accuracy. The method was validated for a envelope designs by comparing the with complete 3-D models.

关键词： Thermal bridge model reduction window frame thermal transfer

作者: Y.Gao J.J.Roux L.H.Zhao

作者单位: Department of Building Science, Tsinghua University, Beijing 100084, China; Thermal Sciences Center – Building Physics (CETHIL), National Institute of Applied Sciences Lyon, Cl Department of Architecture, South China University of Technology, Guangzhou 510640, China

会议类型: 国际会议

会议名称: 第10届建筑模拟国际会议

会议地点: 北京

会议语种:英文

在线出版日期: 2007-09-03（万方平台首次上网日期，不代表论文的发表时间）