Optical interferometry Endpoint Detection for Plasma Etching
The optical interferometry is a non-invasive plasma diagnostic method.Etch experiment were carried out in a high density plasma etching tool (ICP).The theoretic model for optical interferometric endpoint detection and prediction in plasma etching are presented.It is observed that the optical properties of oxide layer and polysilicon layer can affect the interferometric signals.The endpoint algorithm and real time plasma parameters diagnostics are discussed,then process control with optical interferometry during the poly-silicon etch is described.The endpoint prediction technique has been applied to poly-silicon gate etching in high density plasma etching tools.
optical interferometry plasma etching endpoint detection theory model process control
Wang Wei Lan Zhongwen Wen Wu Gong Yungui
College of Electronics Engineering,Chongqing University of Posts and Telecommunication,Chongqing 400 College of Microelectronics and Solid State Electronics,UESTC,Chengdu,610054 China Chongqing Chongyou Information Technology Co.LTD,Chongqing,400065 China
国际会议
西安
英文
2007-08-16(万方平台首次上网日期,不代表论文的发表时间)