Wafer Defects Detecting and Classifying System Based on Machine Vision

摘要：

The wafer defects detecting and classifying system based on machine vision aims at inspecting macro wafer defects. After acquiring disk images using CCD, through digital images process we realized defects inspection and defects segmentation. Finally defects classification was achieved by neural networks. The experiment results prove that the proposed system features a strong background of specialty and can be applied into practice.

关键词： wafer machine vision image process defect detection neural network

作者: Zeng Zhen Dai Shuguang Mu Pingan

作者单位: College of Optical and Electronics Information Engineering,University of Shanghai for Science and Technology,Shanghai 200093 China

会议类型: 国际会议

会议名称: 第八届国际电子测量与仪器学术会议(Proceedings of 2007 8th International Conference on Electronic Measurement & Instruments)

会议地点: 西安

会议语种:英文

在线出版日期: 2007-08-16（万方平台首次上网日期，不代表论文的发表时间）