Study on the Integrated Quality Information Systems of Semiconductor Packaging Processes
Based on the study of the processes of semiconductor packaging, three integration models were put forward. One is a static integration model based on the products, materials, specifications and devices. The other is a dynamic model based on the manufacturing orders and the manufacturing processes. The third one is an integration model of all kinds of quality tools based a central database, the quality tools include SPG ( Statistical Process Control), Design of Experiment (DOE), MSA (Measurement System Analysis), et al. Based on these models, a framework of integrated quality information system for semiconductor packaging is studied. Through this framework, large-scale quality data, manufacturing processes and the quality tools can be integrated effectively. At last, a prototype was developed based on SQL Server2000 and Microsoft visual sutdio. net
Semiconductor Packaging Integrated Quality Information Systems Integration Model Prototype
He Shuguang Li Li
School of Management, Tianjin University, Tianjin P.R.China, 300072 School of Electronics and Information Engineering, Tianjin Professional College, Tianjin P.R.China,
国际会议
天津
英文
2007-10-20（万方平台首次上网日期，不代表论文的发表时间）