Packaging and Microelectromechanical Systems (MEMS)

摘要：

Packaging is critical to the advancement of microsystems integrating microelectromechanical systems (MEMS) with microelectronic, optoelectronic and microwave devices. This paper will discuss microsystems packaging with three cases:a) packaging of MEMS: flip-chip assembly to interconnect MEMS devices with other components; b) packaging for MEMS: novel MEMS devices fabricated using packaging technologies such as flexible circuit; and c) MEMS for packaging: MEMS devices used for active alignment for optoelectronic packaging. With such a close relationship between packaging and MEMS, we expect to see many novel microsystems with packaging and MEMS technologies fully integrated in the future.

作者: Y.C.Lee

作者单位: Department of Mechanical Engineering University of Colorado, Boulder, CO 80309-0427, USA

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 23-27

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）