Chip-To-Chip Interconnection by Mechanical Caulking Using Reflowed Sn Bumps

摘要：

A new chip-to-chip interconnection method utilizing mechanical caulking has been developed recently. In this method, bonding between the chips is achieved by deformation-injection of Au stud bump on a chip into the through via hole in the other chip. In this paper, we introduce a modified caulking technology using reflowed Sn bumps instead Au stud bumps sinc e Sn can be deformed more easily than Au. The chip-to-chip interconnection using reflowed Sn bumps and through via hole electrodes was successfully made at room temperature or at 270 ℃. The contact resistance of the solder joint was less than 35 mΩ per joint.

作者: Ju-Heon Yang Young-Ho Kim Jae-Seung Moon Won-Jong Lee

作者单位: Department of Materials Science & Engineering, Hanyang University, 17 Haedang-dong, Seongdong-gu, Se Department of Materials Science & Enginerring, KAIST, 373-1, Guseong-dong, Yuseong-gu, Daejeon, 305-

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 81-82

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）