Research Progress on Electrochemical Deposition in Electronic Packaging
The Printed Circuit Board (PCB) technology is developing in the aspect of small size, lightweight, high density and high stability, so it makes strict requirement to the electrochemical deposition technology in the PCB manufacturing. This paper shows the mechanism of electrochemical deposition in the PCB manufacturing in detail, including the electroless plating technology and the electroplating technology, briefly introduces the process of PCB manufacturing with the combination of this two kinds of technology, introduces the development and research progress of electroless plating technology and electroplating technology in detail, proposes some problems in electrochemical deposition process, finally introduces some improvements of electrochemical deposition in the aspect of the stability of plating solution, the composition of plating solution and some practical advanced technique.
Dongsheng Zhu Junxi Lei Changhong Wang Hanying Hu
Educational Ministrys Key Lab of Enhanced Heat Transfer andEnergy Conservation, School of Chemical and Energy Engineering, South China University of Technology, No.361, Wushan Road, Guangzhou, Guangdong 510640, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
83-87
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）