3-D Large-Scale IC/MEMS Co-Integration Using Liquid Solder for Flip-Chip Assembly
In this paper, we discuss a flip-chip packaging method using liquid solder for 3-D large-scale Electronic/MEMS cointegration. This approach has been inspired from selfassembly technique which is emerging as one of the main methods for fabrication of heterogeneous micro- and nanosystems. We proposed to form solder bump by coating liquid solder directly on electrodes of a MEMS chip based on sophisticate microstructures of electrostatic microactuator array. Self-alignment and assembly techniques for electronic receptor chip were also detailed in order to achieve efficient flip-chip of MEMS and Electronic chip without any stiction and contamination problem. Functionality of the system has been validated and perspectives discussed.
Y.-A.Chapuis A.Debray H.Fujita
LIMMS/CNRS-IIS (UMI 2820), 4CIRMM, Institute of Industrial Science, University of Tokyo, Tokyo, Japa Canon Research Center, Canon Inc., 30-2, Shimaruko 3-chome, Ohta-ku, Tokyo 146-8501, Japan LIMMS/CNRS-IIS (UMI 2820), 4CIRMM, Institute of Industrial Science, University of Tokyo, Tokyo, Japa
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
88-92
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）