New Sensor Packaging Concept for Avionic Application

摘要：

A new packaging technology for a Micro-ElectroMechanical System (MEMS) pressure sensor was developed to allow the integration of the sensor in a probe mounted on the outside of the airplane. Thus this packaging concept will increase the reliability of equipment by avoiding extra pneumatic connections. Intrinsic advantages of this approach are the avoidance of pressure leaks and the elimination of bad pneumatic connection risk during installation or maintenance phases.

作者: R.Aschenbrenner E.Jung T.Braun U.Oestermann J.Bauer K.-F.Becker H.Reichl

作者单位: BECAP- Berlin Center for Advanced Packaging Fraunhofer Institute for Reliability and Microintegratio BECAP- Berlin Center for Advanced Packaging TU Berlin Microperipherics Center, Gustav-Meyer-Allee 25

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 97-100

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）