Local Melting and Formation Steps of Solder Bumps via Induction Heating Reflow

摘要：

This work focuses on the nonuniform melting process and its theoretical explanation. After induction heating for 0.8 s,1.0 s, 1.4 s and 2.0 s, different welding state can be obtained,which gives a proof of the melting process. The experiment results demonstrate that the skin effect of induction heating forms the great temperature gradient in the solder bump. The computation results give a theoretical support of the local melting phenomena. The surface melting of solder ball can affect the height and shape of the solder bumps, which is an important factor of the thermal reliability for BGA.

作者: Hongbo Xu Mingyu Li Gang Cheng Jongmyung Kim Daewon Kim

作者单位: Shenzhen Graduate School, Harbin Institute of Technology, HIT Campus, Shenzhen University Town, Xili Jeonnam Provincial College, Jeonnam 517-802, Korea

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 101-104

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）