Electromigration Study on Micro-vias of Multi-layer Anodic Alumina Substrate with a Thermal Compensated on-line Measurement Scheme
The Kelvin structure was designed on alumina MCM-D substrate to evaluate the substrate electromigration (EM)reliability. The Median Time To Failure (t50) and the resistance shift of the interconnection via of Kelvin structure were measured by applying different current (DC) under different ambient temperatures. A thermal compensation method was adopted which ensured the packaged test structures fail at the same condition. The test results show that the active energy and the current density exponent of anodic alumina substrate are 0.57eV and 1.03 respectively.The failure of the Kelvin structure during EM test is caused by the void formation at the interconnection of lines and vias where the current bending in 90-degree coruer accelerate the EM process.
Dapeng Zhu Junrong Guo Le Luo
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Chang Ning Road Shanghai 200050, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
105-108
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）