Multilayer Hybrid Circuit Technology

摘要：

The technology that Multilayer hybrid circuits use dielectric layer to insulate stacked conduct has been applied many years, but it is limited by the layers and product yield.This paper introduces a newly dielectric paste of Heraeus,recommend several material systems for multilayer hybrid application. Provide comprehensive data based on experiment in migration stability, laser trimming, adhesion, wire bonding reliability and compatibility. This technology would meet hybrid company demands necessary in multilayer hybrid design, manufacturing process, and product reliability. There is a great benefit for existing thick film technology in both commercial and reliability products application.

作者: Stefan Flick Qingsheng Luo Randy.Klein

作者单位: Heraeus TFD, Hanau, Germany Heraeus Materials Technology Shanghai Ltd.China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 116-120

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）