The Thermal Analysis of QFP Components Geared to the Needs of the Application of Encapsulation Design and Assembly

摘要：

That the QFP components are applied successfully depends on its heat design and analysis. So, in this paper,facing the application of encapsulation design and assembly, a three dimensional model based on temperature field and its simulation analysis is carried out by using the finite element method under different cooling condition and structure parameters, according to such problems for QFP as cooling design、 the heat effect of the thickness of encapsulation layer and chip. And, some relevant results are achieved and some corresponding advices for heat design are put forward with practice. These methods and conclusions can provide the QFP designer of structure and techniques of components encapsulation and assembly a lot of references.

关键词： QFP component heat analysis finite element method

作者: De-jian Zhou Hong-yan Huang Kai-qiang Peng

作者单位: Guilin University of Technology, Gulin 541004,Guang Xi,China;Guilin University of Electronic Technol Guilin University of Electronic Technology, Guilin 541004,Guang Xi,China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 129-133

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）