Modeling Automation System for Electronic Package Thermal Analysis using Excel Spreadsheet
Thermal simulation and analysis play a significant role in development of new generation of IC package design.However, in general, IC design engineers and package engineers do not have the skills of performing such simulation and analysis. One way of overcoming this problem is to develop a tool which can perform thermal analysis on package models automatically. Based on this idea, a customized tool called WBExcel is developed with ANSYS(R) Workbench and Excel. It is easy for user to input necessary data in an intuitive Excel spreadsheet. After that the whole thermal simulation (including meshing, loading/boundary condition, solving,post-process and thermal results) will be completed automatically and efficiently. This paper introduces the general methodology of the simulation interface and system.This simulation tool has been applied to MLP package family and the results agree well with those from the normal ANSYS simulation and measurement.
Yuanxiang Zhang Lihua Liang Yangjian Xia Yong Liu Scott Irving Timwah Luk
Fairchild-ZJUT Joint Lab, Zhejiang University of Technology, Hangzhou, China Fairchild Semiconductor Corp, Portland, ME, USA
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
147-150
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）