Characterization and Modelling of Cure Kinetics of A Molding Compound
(0) Packaging failures has always been the bottleneck of the development on the new techniques of IC packaging using molding compounds. Numerous simulations are developed to minimize the maximum stress during or after the packaging process. Within those simulations, a reliable kinetic model is indispensable since the viscoelastic properties are related strongly with conversion during the cure process. In this paper, the cure kinetics of a molding compound is described by the Kamal-Sourour equation, including the effect of diffusion limitation, and the corresponding parameters are determined. Furthermore, a preliminary dynamic mechanical experiment during cure is presented to show an application of our cure kinetic model.
C.Qian K.M.B.Jansen L.J.Ernst C.Bohm A.Kessler H.Preu M.Stecher
Delft University of Technology, Mekelweg 2, 2628 CD Delft, Netherlands Infineon Technologies AG (AIM AP), 81726 Munich, Germany
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
156-158
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）