Wafer Level Micropackaging for Distributed MEMS Phase Shifters

摘要：

A novel packaging structure which is performed using wafer level micropackaging on the thin silicon substrate as the distributed MEMS phase shifters wafer with vertical feedthrough is presented. The RF performances of proposed structure are investigated using Microwave Studio(CST). The results show that the insertion loss (S21) and return loss (S11)was -0.4- -1.84dB and under -10dB at 1-50GHz, respectively.And especially, the phase shifts of 3600 are obtained at 48GHz. This indicate that the proposed packaging structure for the distributed MEMS phase shifters can provide the maximum amount of phase shift with the minimum amount of insertion loss and with return loss of less than -10dB.

作者: Xun-jun He Qun Wu Yue Wang Ming-xin Song Jing-hua Yin

作者单位: School of Electronics and Information Technology, Harbin Institute of Technology, 92 West Da-Zhi Str School of Electronics and Information Technology, Harbin Institute of Technology, 92 West Da-Zhi Str School of Applied Sciences, Harbin University of Science and Technology, 58 Xue Fu Road, Harbin 1500

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 159-162

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）