The Study for Thermal Analysis Technology of Three-Dimension SRAM Component
The thermal capacity of unit volume is increasing with the development of 3D die package density. The technology of thermal analysis and thermal design for 3D package becomes more and more important. This paper analyzes the structure and working mode of a particular 3D SRAM component. The thermal distribution is simulated with the Ansys software in which the finite element method is applied. The simulation results can be well compared with the experimental data,which further supports the reliability design of 3D SRAM package technology and the thermal analysis technology.
Yusheng Cao Tong Jiang Jun Liu Binhao Lian
Beijing Microelectronics Technology Institute MXTronics Corporation, Beijing 100076, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
163-166
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）