Efficiency Evaluation of Full-Wave Electromagnetic Simulation Techniques in 3D WB-PBGA Package Modeling

摘要：

Package modeling and simulation is the essence of every designer daily work flow. With a trend towards ever more complex designs, the potential reward for designer is the ability to solve previously intractable problems quickly and accurately. Experts still argue about the fastest and most elegant approaches to solving electromagnetic problems yet no single method has emerged as an outright winner 1. This paper presents a case study to make comparison between two enormously commercially-used full-wave electromagnetic (EM) simulation techniques in the advanced packaging technology. It examines the efficiency in terms of simulation time and memory requirement when modeling and simulating a 3D WB-PBGA package. Simulation results in both frequency and time domains have been obtained and correlated with empirical data.

作者: Jackson C.P.Kong Linus Lau

作者单位: Intel Microelectronics (M) Sdn.Bhd.Bayan Lepas FTZ Phase 3, 11900 Penang, Malaysia

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 179-182

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）