Fracture Simulation of Solder Joints by a Lattice Model

摘要：

Solder joints serve as mechanical, thermal and electrical interconnections between the electronic packages and the printed circuit board (PCB). Fracture of the solder joint is the most common failure mechanism in microsystem packages due to mechanical loads. In order to satisfy the demand for understanding the process of solder joint fracture, there is a need for a validated model, which is simple, reliable, and able to clarify of physics-of-failure of solder joint for design improvement. In this paper, the lattice model has been established to simulate the process of solder joint fracturing.The results show that the proposed lattice model can easily be used to predict the cracking of solder joint under tensile loading. The predicted crack pattern agrees well with that observed in experiments.

作者: Tong An Fei Qin

作者单位: School of Mechanical Engineering and Applied Electronic Technology, Beijing University of Technology,Beijing 100022, China,

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 183-186

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）