The Design of New Ultrasonic Transducers for Wire bonding Devices

摘要：

Ultrasonic transducer is an important part of bonding-head in wire bonding device. Bonding quality is effected by ultrasonic transducer properties. According to a dimension plane-wave theory, an initial design of ultrasonic transducer is presented. Ultrasonic transducer modal frequency is calculated by FEM. Prototype is fabricated and tested using impedance analysis instrument. Experimental results indicate that ultrasonic transducer has 128 kHz longitudinal vibration frequency. Ultrasonic transducer vibration properties can satisfied the demand of wire bonding device.

作者: Yimin Wu Jian Chen Xingyu Zhao Fujun Wang

作者单位: School of Mechanical Engineering, Tianjin University, Tianjin, 300072;School of Mechanical Engineeri School of Mechanical Engineering, Hebei University of Technology, Tianjin 300130, China School of Mechanical Engineering, Tianjin University, Tianjin, 300072

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 201-203

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）