Thermal Analysis of LEDs for Liquid Crystal Displays Backlighting
This paper investigated the thermal design of the light emitting diode (LED) onto the board and its packaging. The LED was a 6-lead MultiLED with 3 chips designed for LCD backlighting and other lighting purposes. A 3D finite element model of this LED was built up and thermal analysis was carried out using the multi physics software package,PHYSICA. The modeling results were presented as temperature distributions in each LED, and the predicted junction temperature was used for the thermal resistance calculation. The results for the board structure indicated that (1) removing the foil attach decreased the thermal resistance,(2) Increasing the copper foil thickness reduced the thermal resistance. Package design indicated that the SMT designed LED with integrated slug gave lower thermal resistance. Pbfree solder material gave lower thermal resistance and junction temperature when compared with conductive adhesive.
C.Yin Y.Lee C.Bailey S.Riches C.Cartwright R.Sharpe H.Orr
School of Computing and Mathematical Sciences, University of Greenwich, London, UK Micro Circuit Engineering, UK School of Computing and Creative Technologies, University of Abertay Dundee, UK Thin Film Solutions, UK
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
212-216
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）