Thermal Performance Analysis for Packaging Configuration Design of Multifinger GaInP Collector-Up HBTs as Small High-Power Amplifiers

摘要：

A finite-element modeling (FEM) methodology is utilized to investigate the thermal performance of GaInP collector-up heterojunction bipolar transistors (C-up HBTs) with thermalvia packaging configurations. The thermal interaction between HBT fingers has been examined based on the temperature distribution phenomena in multifinger C-up HBTs. The results obtained from the C-up HBT with a threefinger structure indicate that the thickness of thermal-via configuration can be further reduced by 33％ without deteriorating the thermal performance. From this analysis, it is demonstrated that thinning the thermal-via packaging design should be an effective approach for miniaturization of C-up HBTs as high-power amplifiers in cellular-phone communication systems.

作者: H.C.Tseng P.H.Lee J.H.Chou

作者单位: Department of Electronic Engineering, Kun Shan University, Tainan 71003, Taiwan, China Department of Engineering Science, National Cheng Kung University, Tainan 70101, Taiwan, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 221-223

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）