Thermal Management of High-power White LED Package

摘要：

With the increasing luminous efficacy of Light emitting diode(LED) and the successful fabrication of power high brightness LED chip (HB-LED), solid state lighting using white HB-LED becomes feasible. A novel package and thermal analysis based on ANSYS software for high-power white LED were presented in my thesis, Package structures were optimized based on the result of thermal analysis.Considering cost and dimensional limitation, the thermal structural optimization of LED was achieved.

作者: Qian CHENG

作者单位: School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 230-233

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）