Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Measured by Nanoindentation

摘要：

We report in this paper Youngs moduli and hardness of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds (IMCs)measured by nanoindentation. The samples were prepared by annealing Sn-Cu and Sn-Ni diffusion couples. Indentations performed along the directions lateral and perpendicular to the IMC layers show statistically indistinguishable Youngs moduli and hardness for each of the three IMCs, implying that these polycrystalline IMC aggregates are rather isotropic. Nanomechanical responses of the IMCs were shown to depend greatly on the strain rate during loading while independent of the strain rate during unloading.Multiple pop-in events were observed for Cu6Sn5 during loading at a strain rate lower than about 0.1 s-1 to 0.5 s-1.Topographies of the residual impressions were quantitatively measured and the pile-up features were apparent for the three IMCs.

作者: Ping-Feng Yang Yi-Shao Lai Sheng-Rui Jian Jiunn Chen

作者单位: Central Labs, Advanced Semiconductor Engineering, Inc., Nantze, Kaohsiung, Taiwan, China Department of Materials Science and Engineering, I-Shou University, Kaohsiung, Taiwan, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 244-248

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）