Effect of Copper Oxide Layer on Solder Wetting Temperature under a Reduced Atmosphere
The wetting behavior of SnPb solder on copper surface in absence of flux was investigated in a forming gas atmosphere (5％ H2 and 95％ Ar). X-ray photoelectron spectroscopy (XPS) analysis indicated that Cu2O oxide layer, 2.0-4.2 nm thick, was formed after exposing the milled and polished copper surface in air from 5 min to 5 hours. The wetting temperature did not change much after copper was exposed to air for more than 3 hours. Wetting took place when molten solder was in contact with reduced copper surfaces, the reaction between pure copper and tin followed afterward. The initial temperature of solder wetting on copper was close to the reduction temperature of Cu2O and increased with the thickness of the surface oxide.
Lei Zhang Guangwei Sun Li Li J.K.Shang
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of College of Material Science and Chemistry Engineering, Harbin Engineering University, Harbin 15001,
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
250-253
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）