Electromigration in Lead-Free Sn3.8Ag0.7Cu Solder Reaction Couple
Electromigration is one of the severe reliability problems in IC progress. In this paper, the electromigration of eutectic Sn3.8Ag0.7Cu Solder reaction couples were studied under high temperature (150℃) and high current density (5×103A/cm2) in three days. An original design which could reduce the local joule heating caused by current crowding was produced. Voltage change was also monitored during this experiment. Hillocks and valleys were found at the anode side and cathode side respectively. Unlike aging test,electromigration could promote the formation of intermetallic compound (IMC) at cathode side and inhibit the formation of IMC at anode side. Cracks also appeared along the cathode side after electromigration in three days, but they were not leading the solder reaction couple to failure.
Hongwen He Guangchen Xu Hu Hao Fu Guo
College of Materials Science and Engineering, Beijing University of Technology 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
258-261
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）