Effect of Thermal-Shearing Induced Microstructural Coarsening on SnAgCu Microelectronic Solder

摘要：

The creep response of solder joints in a microelectronic package, which are subjected to aggressive thermal-shearing cycling during service, often limits the reliability of the entire pack age. Furthermore, during cycle,the microstructures of the new lead-free solders (Sn-Ag-Cu) can undergo significant in strain-enhanced coarsening, resulting in in-service evolution of the creep behavior. In this paper, the coarsening kinetics of Ag3Sn particles in Sn-Ag-Cu solder are studied, and the results are correlated with impression creep data from individual microelectronic solder balls subjected to thermal aging treatments. The formation mechanism of Ag3Sn panicles under the thermal-shearing cycling condition was investigated.

作者: Lihua Qi Jihua Huang Xingke Zhao Hua Zhang

作者单位: School of Material Science and Technology, University of Science and Technology, Beijing 30 Xueyuan Rd, Haidian District, Beijing, P.R.China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 271-275

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）