Observation of Ultrasonic Al-Si Wire Wedge Bond Interface Using High Resolution Transmission Electron Microscope

摘要：

Due to small bond size, short bonding time, especially slight interface reaction, bonding details can not be recognized using scanning electron microscope and energy density x-ray spectrum. In order to understand the physical mechanism of ultrasonic wedge bonding, in this paper, bond interface of ultrasonic AlSil wire wedge bonding on Au/Ni/Cu pad was investigated under high resolution transmission electron microscope. Au8Al3 intermetallic compounds were identified by convergent beam electron diffraction, thickness of which was about 200nm and its lattice images were captured. Solid-state diffusion theory can not be used to explain why such thick compound formed within milliseconds at room temperature. Ultrasonic effects attributed to formation of the metallurgical bonds.

作者: Hongjun Ji Mingyu Li Younggak Kweon Woongseong Chang Chunqing Wang

作者单位: Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 P.R.China;State Key Laborat Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 P.R.China Welding Research Center, Research Institute of Industrial Science and Technology, Pohang 790600, Kor State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, 92,

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 291-294

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）