Wettability and Reliability Evaluation of Sn-9Zn solder on Cu Substrates Using Three Novel Soldering Fluxes
The wetting behavior of Sn-9Zn solder on Cu substrates with three types of novel soldering fluxes (Flux1, Flux2 and Flux3 as abbreviation) and the effect of fluxes residues on reliability of PCB were investigated. Two methods, spreading test and wetting balance test were used to estimate the wettability of Sn-9Zn solder on Cu substrates. Flux2 and Flux3 were promising fluxes for Sn-9Zn solder in electronic assembly due to little corrosion of fluxes residues and halide-free in their flux formulations, though Sn-9Zn solder exhibited better wettability with Flux1 in two test methods. Surface insulation resistance (SIR) test estimated performance of electric insulation of the fluxes residues. Samples soldered with Flux2 and Flux3 had higher SIR readings than Flux1, which indicated higher reliability of Flux2 and Flux3. By means of SEM and EDS, it was found that serve corrosion was caused by the chloride residues of Flux 1 which contained chloride activators.
Dongxia Xu Yongping Lei Lei Zhu Zhidong Xia Fu Guo Yaowu Shi
College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100022, PR China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
318-323
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）