Thermodynamic Calculation of Phase Equilibria and Its Applications in the Sn-Ag-Cu-Ni-Au System
Sn-Ag-Cu base solders are the most potential candidates to substitute of Sn-Pb eutectic solder. Gold (Au) coatings are used to protect conductor surface from oxidation and thereby to promote the solderability, and nickel (Ni) is often used as a diffusion barrier layer between lead-free solders and substrates to restrict the growing of intermetallic compound layers. And the gold and nickel also are added to the Pb-free solders to improve their performance. In the present work, the thermodynamic calculations of phase equilibria in the Sn-AgCu-Ni-Au system were carried out using the CALPHAD method. Some examples of application are presented, and it is shown that the CALPHAD method is a good tool to design Pb-free solders and understand the interfacial reaction.
F.Gao C.P.Wang X.J.Liu K.Ishida
Department of Materials Science and Engineering, College of Chemistry and Chemical Engineering, and Department of Materials Science, Graduate School of Engineering, Tohoku University, Sendai 980-8579,
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
324-327
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）