Melting Temperature and Physical Properties of Sn-Ag-Cu-Mg Lead-Free Solders Based on Uniform Design
In this paper, Sn-Ag-Cu-Mg lead-free solders based on an eutectic Sn-Ag-Cu alloy were prepared by means of uniform design. Further investigations were carried out in aspects of melting, wettability, thermal stability and other physical properties employing differential thermal analysis (DTA), Xray diffraction (XRD), etc. It is showed that the melting temperatures decrease when the element of Mg was added in the ternary Sn-Ag-Cu solder alloy systems, and the ranges of melting temperature are wider for those solders with lower melting points. For Sn-Ag-Cu-Mg solders, the melting range with less Mg addition is wider, while its melting point is lower. The wettability of the solders is associated with the Mg concentration. With the Mg content ranged from 0.1％ to 0.7％, the spreading areas of Sn-Ag-Cu-Mg solders are only 50～70％ of that of the near-eutectic Sn-4.0Ag-0.5Cu. With the added Mg, the thermal stability of solders is depressed,while the density and electrical conductivity are as same as those of Sn-4.0Ag-0.5Cu.
Sheng Lu Baohua Wang Chenggang Wei Jing Chen Weijun Wang
Department of Welding and Materials Forming, Jiangsu University of Science and Technology, 2 Mengxi Department of Mechanical Engineering, Jiangsu University of Science and Technology, 2 Mengxi Road, Z
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
328-330
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）