The Effect of the Different Teflon Film on Anisotropic Conductive Adhesive Film (ACF) Bonding
A commercial Hitachi anistropic conducting film (ACF)was used to form the electrical interconnection between electrolysis Tin coated copper pads on a polyamide flexible circuit (FPC) and ITO glass plate substrate, the model of ACF was ANISOLM AC-7106-25. The ACF used in this study was 25μm in thickness, 1.5mm in width and made of insulating epoxy resin in which nickel and gold plated polymer particles were dispersed. The particles were 5μm in diameter. Epoxy resin was selected as the insulating resin and thermosetting because of its strong adhesion to various substrates and favorable melt viscosity. The ACF interconnection was a blank ITO (In2O3; SnO2) deposited glass with surface resistance of 30-40Ω/sq and flexible printed circuit (FPC)with patterned metallization I/O pads. The metal pad on flexible film consisted of approximately 35μm thick copper,electrolytic plated 2μm Tin. The pad length is 2.1 mm and the pad pitch is 0.4mm.The equipment used in the fabrication of the specimens was TCW-125. The Teflon film used in this study was 50μm,100μm, and 200μm in thickness respectively, and made by different manufactories. Before the specimens were fabricated, the thermocouple was used to probe the bonding temperature ramp. It shows the structure of the bonder and the method of the thermocouple used to measure bonding temperature ramp. In this test the specimens was made different bonding temperature increasing rate of 6s, 9s and 12s for the different Teflon films. The curve of the bonding temperature ramp was shown in the paper. The performances of the ACF joints were affected by flow of the conductive particles and the degree of curing of the ACF, which was determined by the bonding temperature ramp rates. The bonding strength was found by peeling test. The electronic particle morphological change was observed. The bonding strength variety also was investigated.
Jun Zhang Xu Chen
School of Chemical Engineering & Technology, Zhengzhou University, Zhengzhou, 450001, P.R.China School of Chemical Engineering & Technology, Tianjin University, Tianjin, 300072, P.R.China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
331-332
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）