Evolution of Cu/Al Intermetallic Compounds in the Copper Bump bonds during Aging Process
Growth of Cu/Al intermetallic compounds (IMCs) at the interface between the copper bond and the Al metallization pad would increase the contact resistance and degrade the bond reliabilities. In this study, the thermosonic copper bump bonds were aged at 250 ℃ for 1 to 196 hours. Then the evolution of Cu/Al IMCs was investigated. Three IMC layers with different colors were found at the Cu/Al interface using the optical microscopy on the xy plane cross-section of the ball bond. The main phases in the Cu/Al IMC are confirmed to be Cu9Al4, and CuAl2. CuAl is believed to be another phase in the copper bond. During the aging process, Cu/Al IMC grew from the periphery of the bond initially and propagated inward to the centre area later. Moreover, some cavities appeared between the IMC layer and bond bottom from the bond periphery and developed into the centre area.
Yanhong Tian Chunjin Hang Chunqing Wang Y.Zhou
Microjoining Lab, State Key Lab of Advanced Welding Production Technology, Harbin Institute of Techn Microjoining Lab, State Key Lab of Advanced Welding Production Technology, Harbin Institute of Techn Microjoing Lab, Department of Mechanical Engineering University of Waterloo, Canada, N2L 3G1
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
347-351
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）