Aluminum/Diamond Composites and Their Applications in Electronic Packaging
For the outstanding properties of diamond and aluminum,diamond reinforced aluminum matrix composites have been developed. In nowadays, Al/diamond composites can be fabricated by many different techniques. Among these fabrication methods, gas pressure infiltration and squeeze casting infiltration are regarded promising and effective.The microstructure and interface reaction of Al/diamond composites are discussed in this paper. The results show that though the forming of Al4C3 on the interface of Al/diamond composite can improve the bonding condition, it also has negative effect on the thermal properties of the composites.The thermal conductivities and CTEs of Al/diamond composites are the property mainly studied. Unfortunately,the thermal degradation of diamond has precluded its use as reinforcement.Now, MER Corporation has developed commercial products of Al/diamond composites, and has used them in some electronic packages. We can believe that Al/diamond composite materials will play much more important roles in the thermal management of electronic packaging.
Zhensong Tong Zhuoshen Shen Yujuan Zhang
School of Materials Science and Engineering, Beijing University of Science and Technology, 30 Xueyuan Road, Beijing 100083, Peoples Republic of China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
356-362
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）