Characterization and Modeling of Moisture Absorption of Underfill for IC Packaging

摘要：

Underfill is a highly particle filled epoxy polymer used in flip chip to fill the gap between the leadframe and die or between die and die. In order to be able to flow in the thin gap, the silica filler particle must have a diameter below l0μm. This epoxy underfill material mechanically couples the chip and substrate and decreases the stress in the solder joints,therefore enhancing solder fatigue life. Good adhesion between the epoxy underfill and the surface of solder ball,silicon chip, and substrate is necessary to minimize stress in a package. Use of the non-hermetic material does raise a potential concern, i.e. moisture induced interfacial delamination and moisture expansion may cause failure. In this study, moisture absorption and desorption properties were investigated, such as moisture absorption equilibrium weight gain and diffusion coefficients at different temperature and different humidity are tested and characterized, moisture absorption and desorption kinetics are tested and fitted

作者: Xiaosong Ma K.M.B.Jansen L.J.Ernst W.D van Driel O.van der Sluis G.Q.Zhang

作者单位: Delft University of Technology, Mekelweg 2, 2628 CD Delft, Netherlands;Guilin University of Electron Delft University of Technology, Mekelweg 2, 2628 CD Delft, Netherlands NXP, Gerstweg 2, 6534 AE Nijmegen, Netherlands

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 380-384

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）