The Growth and Influencing Factors of Voids in SnAg Solder Bump and their Impact on Interfacial Bond Strength
With the trend toward lead-free and miniaturization in consumer electronics, sub 100 micron lead-free solder bumping and its related reliability are becoming one of the important issues in todays electronic packaging industry. The growth and influencing factors of voids in the interfacial region of electroplated Sn-3.0Ag solder bumps on electroplated Cu and their effects on interfacial bonding strength during multi-reflow and aging process were studied.Results show that the volume shrinkage during the phase transformation was the main reason for the void formation during multi-reflow. The Kirkendall effect was the main reason for the void formation during aging. A thick η-phase and the voids at the boundaries among Cu6Sn5 grains promoted the voids growth in the ε-phase. Though the formation of voids had a trivial weakening effect to the shear strength of solder joints, the voids were a threat to the bonding reliability of solder bumps.
Xiaoqin Lin Le Luo
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences No.865 Changning Road, Shanghai; 200050, P.R.China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
385-389
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）