Experimental Studies on the Dynamic Compressive Properties of Lead-Free Solder
In this paper, the quasi-static and dynamic compressive properties of lead-free solders were assessed. Dynamic experiments were conducted using a split Hopkinson pressure bar system at strain rates ranging from 500 to 2000 s-1. It was found that the lead-free solder 96.3Sn3Ag0.7Cu was sensitive to strain rates, its yield strength and flow stress increased remarkably with the increase of strain rate. Furthermore,Johnson-Cook material model was used to estimate visco-plastic behavior and strain rate sensitivity of the solder.The related parameters in the model were determined according to experimental results. Compared with the typical Pb-containing solder Sn63Pb37, The lead-free solder showed some perfect properties and could be used to substitute some Pb-containing solder in microelectronic components packaging and interconnects.
Xiaoyan Niu Zhigang Li Guozheng Yuan Xuefeng Shu
Institute of Applied Mechanics, Taiyuan University of Technology, No.79 West Yingze Street, Taiyuan 030024, Shanxi, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
393-396
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）