Elastic Property of Cu3Sn Determined by a First-Principles Calculation on the Basis of its Crystal Substructure
As compared with the significance for controlling reliability of solder joints, research on elastic behavior of Cu3Sn has not been given enough consideration mainly because of the difficulty in preparing acceptable single-phase sample. In this paper, independent elastic constants of single crystal Cu3Sn are determined from first-principles calculations with a pseudopotential plane-wave method to completely characterize its polycrystalline elastic behavior and elastic anisotropy. The ideal elastic, shear and bulk modulus (E=147GPa, G=56GPa and K=132GPa), as well as the Poissons ratio (v=0.315) of Cu3Sn were predicted by Voigt-Reuss-Hill method. Cu3Sn exhibited distinct anisotropy in Youngs modulus, as shown by the large difference between maximum and minimum, 44GPa, which may be partially responsible for the discrepancy in the experimental results. The Youngs modulus of Cu3Sn with texture in real solder joints was also explored.
R.An C.Q.Wang Y.H.Tian
Department of Electronics Packaging Technology, School of Materials Science and Engineering, Harbin Institute of Technology, 92 Xidazhi Street, Harbin 150001, P.R.China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
397-401
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）