会议专题

Synthesis and Characterization of Novel Multiaromatic Epoxy Resin for Advanced Microelectronic Packaging Applications

The novel multiaromatic epoxy resin and hardener was synthesized and characterized. The mechanical, thermal,electrical as well as flame retardant properties of cured epoxy resins were systematically investigated. Experiment results indicated that the cured novel multiaromatic resins exhibited very good mechanical properties, good electrical properties,high glass transition temperature, good dielectric properties,low moisture absorption and very good flame retardancy.

Zhiqiang Tao Jiapei Ding Haixia Yang Lin Fan Shiyong Yang

Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 10080, China

国际会议

第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

上海

英文

402-404

2007-08-14(万方平台首次上网日期,不代表论文的发表时间)