Aromatic Polyimide Resins for High Density Packaging Substrates
Molecular weight-controlled aromatic polyimide resins for fabrication of high density IC packaging substrates have been developed. The aromatic polyimide resins showed good laminate processability, which could easily dissolve in organic solvent to give low viscosity solution for impregnation of E-glass fiber cloths. After completely removal of the organic volatile, the polyimide/glass fiber (PI/GF) cloth prepreg could be plied up and then thermally cured at 280℃ to give the PI/GF laminate suitable as packaging substrate core. Experimental results indicated that the polyimide laminates have the desirable characteristics for packaging substrate core, including 1) excellent thermal stability with initial thermal decomposition temperature of＞500℃, CTE(in-plane) of 15-19 ppm/℃ and glass transition temperature of ＞220 ℃; 2) good mechanical properties with flexural strength of ＞430 Ma and flexural modulus of 20 GPa,tensile strength of ＞ 230 MPa and impact toughness of 84 kJ/m2; 3) great electrical insulating and dielectric properties 4.1 and dissipation factor of 0.005 etc.; and 4) high peel strength of copper foil to laminate in Cu-claded laminate ( ＞1.5 N/mm).
Hongyan Xu Haixia Yang Jingang Liu Zhiqiang Tao Lin Fan Shiyang Yang
Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Zhongguancun, Beijing 100080, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
405-408
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）