A Computational Model of a Molten Solder Droplet Spreading on Orthogonal Pads
A dynamic model based on energy balance method for describing the solder profile evolution on orthogonal pads is proposed. This model combines the fluid mechanics and the surface physics and accounts for the inertial, viscous and gravitational forces, the interfacial tensions and the equilibrium contact angle of the spreading system. A corresponding computational scheme is developed without invoking the spherical cap assumption. In order to verify the model predictions, the high speed videograhpy technique is used to capture the instantaneous solder profile. The results show that the model prediction is in good agreement with the experimental spreading process. The characteristic of this model is that it can predict not only the equilibrium shape of solder joint but also the instantaneous shape during the spreading process.
Dewen Tian Chunqing Wang Yanhong Tian
Department of Electronics Pacaking Technology, School of Materials Science and Engineering, Harbin Institute of Technology, 92 West Dazhi Street, 150001 Harbin, P.R.China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
435-442
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）