Effect of Cr Content on the Microstructure and Properties of Sn-9Zn Base Lead-free Solder

摘要：

Concentrations of 0.05wt.％, 0.1wt.％, and 0.3wt.％ of Cr were added to Sn-9Zn eutectic alloy to produce Sn-9Zn-Cr alloys. The microstructure is refined with Cr additions, while significantly improves the oxidation resistance, and thins the thickness of oxidation film. The Sn-9Zn-0.1Cr solder have the best oxidation resistance. There is no change in the wettability and liquidus temperature after Cr additions. In addition, the effect of Cr addition on the mechanical properties of Sn-9Zn solder was discussed.

作者: Xi Chen Anmin Hu Ming Li Dali Mao

作者单位: Lab of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 443-447

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）