Effect of Aging on the Interfacial Reaction between Sn-9Zn-xCr Solder and Cu Substrate
The influences of adding 0.05, 0.1, 0.3, 0.5wt.％ Cr to Sn9Zn alloy on growth of intermetallic compound layer (IMCs)at the interface of Sn-9Zn-xCr/Cu was investigated during aging treatment at 85℃ and relative humidity from 20％ to 85％ for 100h, 200h, 350h, 500h. The results show that IMCs thickness of Sn-9Zn-Cr alloys is much thinner than that of Sn9Zn alloy after aging, but there is little difference on IMCs thicknesses among Sn-9Zn-Cr alloys. It is of interest to note that IMCs growth rate of Sn-9Zn-Cr is about 1/4 times of that of Sn-9Zn alloy. We supposed the reason is that Cr can slow down diffusion rate of Zn in solder. It is quite reasonable to consider that reliability of Sn-9Zn-Cr solder joints is better than that of Sn-9Zn solder joints because of thinner intermetallic compound layer.
Xi Chen Anmin Hu Ming Li Dali Mao
Lab of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
448-451
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）