Factors Influencing the Electroless Gold Plating for Ceramic Packaging

摘要：

Electroless gold plating is a perfect gold plating method for high-density ceramic packaging. Compared with electroplating of gold, it has remarkable advantages.However, the solution of electroless gold plating is unstable,the control of gold layer thickness is not easy, so the electroless gold plating is not easily widely applied. In the article, the factors influencing the process of electroless gold plating have been researched, and application discussed by a series of experimentation.

作者: Lei Zhang Sheng-Qian Liu Qiao-Ming Liu

作者单位: Hebei Semiconductor Research Institute, Shijiazhuang 050051, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 463-465

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）