Green Policy in an International Power Management Manufacturing Services Provider in China
Nowadays, power management semiconductor suppliers have taken big steps to provide environmentally sound and green product solutions to meet the ever increasing demand of high performance electronics in the global consumer,industrial, computer, communication and automotive markets.The challenges are two fold. Very strict reliability performance and the green requirements have to be met at the same time. These requirements mainly bring three challenges to current electronic device manufacturers: Lead-free plating process, green compound package and Pb-free die attach materials. GEM, as an international power management manufacturing services provider, has already taken action to meet the global new requirement. In this paper, the research path and process improvement of green package manufacturing in GEM is presented, and the packaging trend of future high power and high thermal capability power management device is also discussed.
Wangsheng Fang Hongbo Yang Ming Zhou Anthony C.Tsui
Advanced Engineering Department, GEM Electronics (Shanghai) Co., Ltd.438 Zhaoxian Rd., Jiading Development Industrial Park, Jiading, Shanghai 201821, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
488-491
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）