The Determinations of Pb, Cd, Hg, Cr6+, PBBs/PBDEs to Comply with RoHS Directive
For RoHS compliance, a method coupled inductively coupled plasma-optical emission spectrometry (ICP-OES),gas chromatography-mass spectrometry (GC-MS), and UVVisible spectrophotometry with microwave technology was developed to determine trace Cd, Hg, Pb, Cr6+, PBBs/PBDEs in electronic and electrical products (EEP). Elements were screened by Energy dispersion X-ray fluorescence spectrometry (EDXRF). In order to achieve good performance, other methods such as colorific test, interelement correction (IEC) and standard addition techniques etc. were performed.By this study,it showed that analyses of Hg, Cd, Pb by ICP-OES and Cr6+ by UV-Visible spectrophotometry had a RSD ＜5％, and a RSD ＜1％ for PBBs/PBDEs by GC-MS analyzer. UV-Visible spectrophotometry offered a good alternative for Cr6+ determination with alkali digestion, the inferences from Fe3+, Pb2+ etc. were eliminated by K2HPO4 buffer. The ramifications from monoBB/BDE to DecaBB/BDE were distinctly separated and successfully determined in the optimized condition. Furthermore,microwave system did an excellent job of consistently putting solid samples into solutions and had a moderate compatibility with spectrometric analyzer due to good recoveries. Though RSD of XRF screening was larger than 10％, it proved to be an easier, cheaper, faster technique. Because of the combination of multiple methodologies, the restricted substances can be determined with good precision and high reliability. It provides a prominent project for EE industries to comply with RoHS compliance.
RoHS compliance Six hazardous substances UVVisible spectrophotometry ICP-OES GC-MS
L.Hua Y.P.Wu B.An Y.C.Chan B.Y.Wu F.S.Wu
Wuhan National Laboratory for Optoclectronics, State Key Laboratory of Plastic Forming Simulation an Wuhan National Laboratory for Optoclectronics, State Key Laboratory of Plastic Forming Simulation an Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, H
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
513-517
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）