Direct Copper Bonded Ceramic Substrates for Use with Power LEDS

摘要：

The past years saw a marked increase in power density for packaged LEDs and also an increase in requested lifetimes for the same modules. This leads to the need for substrate materials that show an improved thermal conductivity and reliability over standard FR4 or insulated metal substrates. Direct copper bonded (DCB)substrates offer a significantly lower thermal resistance and have already become the standard carrier for high power, high voltage inverters and solid state relays.

作者: Alfred Dehmel Dr.Jürgen Schulz-Harder Alexander Roth Ingo Baumeister

作者单位: Electrovac curamik, Im Gewerbepark 75D, D-93059 Regensburg, Germany

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 524-528

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）